Home / Vulnerabilities / CVE-2023-33063
HIGH SEVERITY
CVE-2023-33063 Qualcomm · Multiple Chipsets

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Technical Severity

CVSS v3.1 Metrics

HIGH
7.8 / 10
Minimal Risk Critical
Vector Specification
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Exploitation Likelihood

EPSS Prediction

0.44 %
Predictive Probability
Percentile Rank
62.7 th

Documented as more likely to be exploited than 62.7% of known CVEs.

Detection Date

Dec 05, 2023

Remediation Due

Dec 26, 2023

CISA Catalog Active

Threat Analysis

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Remediation Directive

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

External Intelligence

This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see:

https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a,
NVD

National Vulnerability Database

https://nvd.nist.gov/vuln/detail/CVE-2023-33063